3\" Diamond Copper Bond Polishing Pads with Hook and Loop Backing OEM Customizable for Concrete and Terrazzo Floor Grit:800# please contact us with your

please contact us with your HTC machine model for verification

The high diamond concentration provides for a faster grinding rate while the high quality of the diamonds provides longer grinding life

Coating Removing HTC EZ Quick Lock HTC Diamond Dovetail PCD Grinding Shoes

Connection: HTC  EZ Change Connection

3\" Diamond Copper Bond Polishing Pads with Hook and Loop Backing OEM Customizable for Concrete and Terrazzo Floor Grit:800# please contact us with yourProduct Description Copper bond diamond floor polishing grinding pads provide longer life and achieve better results with less or no scratching marks while polishing concrete floor. They are aggressive cut and have a beveled edge that easily glides over lippage. These pads feature a bi metal bond with a high concentration of diamonds for faster alternative than normal resins. They are ideal for removing deep scratches left behind from metal and vacuum